半固態(tài)高硅鋁合金的熱力學模擬
發(fā)布人：上海艾荔艾合金股份有限公司www.shailiai.cn
更新時間：2016-05-06
采用基于CALPHAD法的熱力學模擬對Al-xSi-yCu-zMg半固態(tài)高硅鋁合金進行合金成分的優(yōu)化設計。實驗以元素Si、Cu、Mg為因變量，對Al-Si-Cu-Mg四元高硅鋁合金進行熱力學模擬，并用DSC測試分析驗證模擬結果，對合金成分進行了優(yōu)化。
半固態(tài)高硅鋁合金的熱力學模擬Thermodynamic simulation of high silicon aluminum alloys for semi-solid processing采用基于CALPHAD法的熱力學模擬對Al-xSi-yCu-zMg半固態(tài)高硅鋁合金進行合金成分的優(yōu)化設計。實驗以元素Si、Cu、Mg為因變量，對Al-Si-Cu-Mg四元高硅鋁合金進行熱力學模擬，并用DSC測試分析驗證模擬結果，對合金成分進行了優(yōu)化。結果表明:Cu、Mg是合金設計的兩個關鍵元素，能顯著影響液相體積分數(shù)對溫度的敏感度以及溫度間隔，而Si元素對其影響較小。結合半固態(tài)合金熱力學設計判據(jù)，Al-17Si-4.5Cu-1.5Mg、Al-17Si-5Cu-1Mg和Al-17Si-4Cu-2Mg是較理想的半固態(tài)觸變成形用高硅鋁合金。
The thermodynamic simulation based on CALPHAD method was applied to optimize the high silicon aluminum alloys Al-xSi-yCu-zMg for semi-solid thixoforming. This simulation was performed with three parameters Si, Cu and Mg, and the results were analyzed and compared with the DSC test, and then, the semi-solid alloys were optimized. The results show that Cu and Mg are two key elements for alloys design and can notably affect liquid volume fraction vs temperature sensitivity and temperature interval, while Si has little effect on these two parameters. Considering the criterion of alloys design, some new optimal alloys for semi-solid processing are available:Al-17Si-4.5Cu-1.5Mg, Al-17Si-5Cu-1Mg and Al-17Si-4Cu-2Mg.
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